Title:
SOLDER CUTTING DEVICE, SOLDER CUTTING UNIT, PART MOUNTING DEVICE, AND PRODUCTION SYSTEM
Document Type and Number:
WIPO Patent Application WO/2021/199440
Kind Code:
A1
Abstract:
A solder cutting device (3) comprises a first holding part (31), a first drive part (32) that feeds a tape-like solder material (21), which is held by the first holding part (31) in a first direction, a cutting part (33) for cutting the tape-like solder material (21), and a second drive part (34) that actuates the cutting part, wherein the first drive part (32) is a first actuator of an electric drive that converts the rotational motion of a rotating body, the axis of which extends in the first direction, to a motion in the first direction, and the second drive part (34) comprises a second actuator that moves a moving body (343) in the first direction, and a connection part (383) that converts the motion of the moving body (343) to a motion in a second direction and transmits the motion to the cutting part (33).
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Inventors:
IKEDA TOSHIOMI (JP)
MATSUYOSHI TETSUNORI (JP)
MATSUYOSHI TETSUNORI (JP)
Application Number:
PCT/JP2020/015378
Publication Date:
October 07, 2021
Filing Date:
April 03, 2020
Export Citation:
Assignee:
HIRATA SPINNING (JP)
International Classes:
B23K3/06; H05K3/34; H05K13/02; H05K13/04
Foreign References:
| JP2008288334A | 2008-11-27 | |||
| JP2010125477A | 2010-06-10 | |||
| JP2004216426A | 2004-08-05 | |||
| JPH05245627A | 1993-09-24 | |||
| JP4838195B2 | 2011-12-14 |
Other References:
See also references of EP 4101573A4
Attorney, Agent or Firm:
IMANO, Shinji et al. (JP)
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