Title:
SOLDER JOINING MATERIAL, CONNECTION STRUCTURE, AND METHOD FOR PRODUCING CONNECTION STRUCTURE
Document Type and Number:
WIPO Patent Application WO/2017/086335
Kind Code:
A1
Abstract:
Provided is a solder joining material whereby solder can be effectively positioned between electrodes to be connected even when the electrode width or the electrode gap is small, and whereby the reliability of conduction and the reliability of insulation can be increased. The solder joining material according to the present invention contains solder particles, flux, and a binder. The solder particle content exceeds 80% by weight. The solder joining material contains solder particles having amino groups or thiol groups on the outer surface as the solder particles, or contains a compound having an amino group or a thiol group as the flux and/or the binder.
Inventors:
KUBOTA TAKASHI (JP)
TAKAHASHI HIDEYUKI (JP)
NISHIOKA KEIZO (JP)
TAKAHASHI HIDEYUKI (JP)
NISHIOKA KEIZO (JP)
Application Number:
PCT/JP2016/083929
Publication Date:
May 26, 2017
Filing Date:
November 16, 2016
Export Citation:
Assignee:
SEKISUI CHEMICAL CO LTD (JP)
International Classes:
B23K35/363; B22F1/102; B22F1/16; H05K3/34; H05K3/36; B23K35/26; C22C13/00
Domestic Patent References:
| WO2009001448A1 | 2008-12-31 |
Foreign References:
| JP2006009125A | 2006-01-12 | |||
| JPH06262386A | 1994-09-20 |
Attorney, Agent or Firm:
MIYAZAKI & METSUGI (JP)
Download PDF: