SOLDER JOINT BODY AND SOLDER JOINING METHOD

Title:

SOLDER JOINT BODY AND SOLDER JOINING METHOD

Document Type and Number:

WIPO Patent Application WO/2017/213189

Kind Code:

A1

Abstract:

A solder joint body (1) has: a first to-be-joined material (M1) and a second to-be-joined material (M2); and a solder joining layer (S) which is disposed between the first and second to-be-joined materials and which joins the first and second to-be-joined materials together. The solder joining layer contains a prescribed volume fraction of a columnar Sn-Cu intermetallic compound (20).

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Inventors:

NAKATA YUSUKE (JP)

Application Number:

PCT/JP2017/021186

Publication Date:

December 14, 2017

Filing Date:

June 07, 2017

Export Citation:

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Assignee:

CALSONIC KANSEI CORP (JP)

International Classes:

B23K35/26; B23K1/00; B23K31/02; H01L21/52; B23K101/40

Domestic Patent References:

WO2016027593A1

2016-02-25

Foreign References:

JP2016058526A	2016-04-21
JP2010179336A	2010-08-19
JP2006167735A	2006-06-29
US20030132271A1	2003-07-17
JP2016128184A	2016-07-14