Title:
SOLDER MATERIAL, SOLDER JOINT, AND PRODUCTION METHOD FOR SOLDER MATERIAL
Document Type and Number:
WIPO Patent Application WO/2016/031067
Kind Code:
A1
Abstract:
Provided is a solder material configured so that it is possible to minimize the growth of an oxide film. The solder material is a solder ball 1A configured from a solder layer 2 and a coating layer 3 that covers the solder layer 2. The solder layer 2 has a spherical shape and is configured from a metal material comprising an alloy in which the Sn content is 40% or more. The solder layer 2 is alternatively configured from a metal material in which the Sn content is 100%. The coating layer 3 comprises a SnO film 3a that is formed on the outside of the solder layer 2 and a SnO2 film 3b that is formed on the outside of the SnO film 3a. The thickness of the coating layer 3 is greater than 0 nm and preferably equal to or less than 4.5 nm. In addition, the yellowness of the solder ball 1A is preferably 5.7 or less.
Inventors:
KAWASAKI HIROYOSHI (JP)
ROPPONGI TAKAHIRO (JP)
SOMA DAISUKE (JP)
SATO ISAMU (JP)
KAWAMATA YUJI (JP)
ROPPONGI TAKAHIRO (JP)
SOMA DAISUKE (JP)
SATO ISAMU (JP)
KAWAMATA YUJI (JP)
Application Number:
PCT/JP2014/072803
Publication Date:
March 03, 2016
Filing Date:
August 29, 2014
Export Citation:
Assignee:
SENJU METAL INDUSTRY CO (JP)
International Classes:
B23K35/26; B22F1/16
Domestic Patent References:
| WO2010061795A1 | 2010-06-03 |
Foreign References:
| JP2009248156A | 2009-10-29 | |||
| JP2009275240A | 2009-11-26 | |||
| JP4084657B2 | 2008-04-30 |
Other References:
See also references of EP 3187299A4
Attorney, Agent or Firm:
YAMAGUCHI INTERNATIONAL PATENT FIRM (JP)
Patent business corporation Yamaguchi international patent firm (JP)
Patent business corporation Yamaguchi international patent firm (JP)
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