Title:
SOLDER MATERIAL, SOLDER PASTE, AND SOLDER JOINT
Document Type and Number:
WIPO Patent Application WO/2019/103025
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide a solder material which shows little discoloration, has excellent wetting properties, is highly reliable in terms of cycling properties, etc., and, when made into a solder paste, has a small rise in viscosity over time. The solder material of the invention in the present application is characterized by comprising Sn, or an Sn-based alloy, and 40-320 mass ppm of As, and by including an As concentration layer.
Inventors:
KAWASAKI HIROYOSHI (JP)
SUDO HIROKI (JP)
ROPPONGI TAKAHIRO (JP)
OKADA HIROSHI (JP)
SOMA DAISUKE (JP)
AKAGAWA TAKASHI (JP)
TAKAHASHI HIROSHI (JP)
KAWANAGO HIROSHI (JP)
YOKOTA SATOSHI (JP)
MUNEKATA OSAMU (JP)
SUDO HIROKI (JP)
ROPPONGI TAKAHIRO (JP)
OKADA HIROSHI (JP)
SOMA DAISUKE (JP)
AKAGAWA TAKASHI (JP)
TAKAHASHI HIROSHI (JP)
KAWANAGO HIROSHI (JP)
YOKOTA SATOSHI (JP)
MUNEKATA OSAMU (JP)
Application Number:
PCT/JP2018/042943
Publication Date:
May 31, 2019
Filing Date:
November 21, 2018
Export Citation:
Assignee:
SENJU METAL INDUSTRY CO (JP)
International Classes:
B23K35/26; C22C13/00; C22C28/00
Foreign References:
| JP2002224881A | 2002-08-13 | |||
| JP2015098052A | 2015-05-28 | |||
| JP2016537206A | 2016-12-01 | |||
| JP2006181637A | 2006-07-13 | |||
| US4954184A | 1990-09-04 | |||
| JP2015020181A | 2015-02-02 | |||
| CN1712175A | 2005-12-28 |
Attorney, Agent or Firm:
INABA, Yoshiyuki et al. (JP)
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