Title:
SOLDER MATERIAL
Document Type and Number:
WIPO Patent Application WO/2018/186218
Kind Code:
A1
Abstract:
Provided is a solder material including 2.5-3.3 wt% Ag, 0.3-0.5 wt% Cu, 5.5-6.4 wt% In, and 0.5-1.4 wt% Sb, the remainder being unavoidable impurities and Sn. Specifically, the solder material is a Pb-free solder not including Pb.
Inventors:
HIRAI YUKIHIKO (JP)
OOMORI KOUKI (JP)
ISUMI MITSUHIRO (JP)
TSUCHIYA AYAKA (JP)
OOMORI KOUKI (JP)
ISUMI MITSUHIRO (JP)
TSUCHIYA AYAKA (JP)
Application Number:
PCT/JP2018/012113
Publication Date:
October 11, 2018
Filing Date:
March 26, 2018
Export Citation:
Assignee:
KEIHIN CORP (JP)
International Classes:
B23K35/26; C22C13/00
Domestic Patent References:
| WO2002040213A1 | 2002-05-23 | |||
| WO2016185674A1 | 2016-11-24 | |||
| WO2010122764A1 | 2010-10-28 | |||
| WO1997009455A1 | 1997-03-13 |
Foreign References:
| JP2002120085A | 2002-04-23 | |||
| JP2016179498A | 2016-10-13 | |||
| JP2010505625A | 2010-02-25 | |||
| JP2004188453A | 2004-07-08 | |||
| JP2002120085A | 2002-04-23 |
Other References:
See also references of EP 3608050A4
Attorney, Agent or Firm:
CHIBA Yoshihiro et al. (JP)
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