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Title:
SOLDER PARTICLES
Document Type and Number:
WIPO Patent Application WO/2020/004513
Kind Code:
A1
Abstract:
The present invention relates to solder particles, each of which partially has a flat portion in the surface. By using these solder particles, electrodes facing each other are able to be appropriately connected, thereby achieving an anisotropic conductive material that exhibits excellent conduction reliability and excellent insulation reliability.

Inventors:
AKAI KUNIHIKO (JP)
EJIRI YOSHINORI (JP)
OKADA YUUHEI (JP)
MORIYA TOSHIMITSU (JP)
SUKATA SHINICHIROU (JP)
MIYAJI MASAYUKI (JP)
Application Number:
PCT/JP2019/025499
Publication Date:
January 02, 2020
Filing Date:
June 26, 2019
Export Citation:
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Assignee:
HITACHI CHEMICAL CO LTD (JP)
International Classes:
B23K35/14; B22F1/00; B23K35/26; C22C12/00; C22C13/00; C22C28/00; H01B1/00; H01B1/02; H01B1/22; H01B5/00; H01B5/16; H01R11/01; H05K3/32
Foreign References:
JPH0523887A1993-02-02
JPH01184201A1989-07-21
JP2010036234A2010-02-18
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
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