Title:
SOLDER PASTE AND BONDED STRUCTURE
Document Type and Number:
WIPO Patent Application WO/2022/153703
Kind Code:
A1
Abstract:
A solder paste which contains at least two solder powders, each containing at least two metal elements, wherein: the average free energy of formation of oxides of the solder powders on a molar basis is -490 kJ/mol or more, said average free energy of formation of oxides of the solder powders being the sum of the respective products (Ai × Bi) of the respective molar ratios (Ai) of metal elements (i) based on all metal elements that constitute the solder powders contained in the solder paste and the respective free energies of formation (Bi kJ/mol) of oxides of the metal elements; and the average melting point of the solder powders on a mass basis is 121°C or less, said average melting point of the solder powders being the sum of the respective products (Cj × Dj) of the respective mass ratios (Cj) of the solder powders (j) based on the total mass of the solder powders contained in the solder paste and the respective melting points (Dj°C) of the solder powders.
Inventors:
OHASHI NAOMICHI
OKAWA YASUHIRO
MATSUNO KOSO
OKAWA YASUHIRO
MATSUNO KOSO
Application Number:
PCT/JP2021/044189
Publication Date:
July 21, 2022
Filing Date:
December 02, 2021
Export Citation:
Assignee:
PANASONIC IP MAN CO LTD (JP)
International Classes:
C22C12/00; B22F1/00; B23K35/14; B23K35/26; B23K35/363; C22C13/00
Domestic Patent References:
| WO2008016140A1 | 2008-02-07 |
Foreign References:
| JP2010285580A | 2010-12-24 | |||
| JP2019096616A | 2019-06-20 | |||
| JP2020055032A | 2020-04-09 | |||
| JP2015530705A | 2015-10-15 | |||
| JPH05318176B1 | ||||
| JPS63180396A | 1988-07-25 |
Attorney, Agent or Firm:
KAMATA Kenji et al. (JP)
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