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Patent Searching and Data


Title:
SOLDER PASTE AND FLUX
Document Type and Number:
WIPO Patent Application WO/2011/080990
Kind Code:
A1
Abstract:
Provided are a solder paste and a flux capable of inhibiting heat slump in reflow soldering. The solder paste contains a solder powder and a flux which comprises a resin component, a solvent component, an activator, a thixotropic agent, and additives. The additives include a heat slump inhibitor component represented by formula (1) or formula (2). (R10 is an aliphatic hydrocarbon group having 14 or more carbons. R11 is a hydrocarbon group.) (R12 is a hydrocarbon group. R13 is a hydrocarbon group. R20 is an aliphatic hydrocarbon group having 14 or more carbons.)

Inventors:
SHIBATA, Seiji (C/O TAMURA KAKEN CORPORATION, 16-2 Ooaza Sayamagahara, Iruma-sh, Saitama 01, 〒3588501, JP)
柴田誠治 (〒01 埼玉県入間市大字狭山ケ原16番地2タムラ化研株式会社内 Saitama, 〒3588501, JP)
KASAHARA, Tomohiko (C/O TAMURA KAKEN CORPORATION, 16-2 Ooaza Sayamagahara, Iruma-sh, Saitama 01, 〒3588501, JP)
笠原智彦 (〒01 埼玉県入間市大字狭山ケ原16番地2タムラ化研株式会社内 Saitama, 〒3588501, JP)
Application Number:
JP2010/071765
Publication Date:
July 07, 2011
Filing Date:
November 29, 2010
Export Citation:
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Assignee:
TAMURA CORPORATION (1-19-43, Higashi-Oizumi Nerima-k, Tokyo 11, 〒1788511, JP)
株式会社タムラ製作所 (〒11 東京都練馬区東大泉1丁目19番43号 Tokyo, 〒1788511, JP)
SHIBATA, Seiji (C/O TAMURA KAKEN CORPORATION, 16-2 Ooaza Sayamagahara, Iruma-sh, Saitama 01, 〒3588501, JP)
柴田誠治 (〒01 埼玉県入間市大字狭山ケ原16番地2タムラ化研株式会社内 Saitama, 〒3588501, JP)
KASAHARA, Tomohiko (C/O TAMURA KAKEN CORPORATION, 16-2 Ooaza Sayamagahara, Iruma-sh, Saitama 01, 〒3588501, JP)
International Classes:
B23K35/363; B23K1/00; H05K3/34; B23K35/26; B23K101/42; C22C13/00
Attorney, Agent or Firm:
SUGIURA, Masatomo et al. (2nd Floor, Metrocity Minami Ikebukuro 29-12,Minami Ikebukuro 2-chome, Toshima-k, Tokyo 22, 〒1710022, JP)
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