Title:
SOLDER PASTE, JOINT STRUCTURE, AND METHOD FOR PRODUCING JOINT STRUCTURE
Document Type and Number:
WIPO Patent Application WO/2019/117041
Kind Code:
A1
Abstract:
This solder paste contains: a mixed filler comprising first metal particles and second metal particles; and a flux, wherein the first metal particles are composed of an alloy including 50-80 mass% of Cu, 5-15 mass% of Ag, 2-10 mass% of Bi, 2-10 mass% of In, and the balance comprising Sn and inevitable impurities, and the second metal particles are composed of a lead-free solder alloy which has a melting point of 260°C or less and contains Sn as an essential component, the content of the first metal particles in the mixed filler being 5.0-14.5 mass%.
Inventors:
OOTANI SATOSHI (JP)
YAMAMOTO YUKI (JP)
FURUSAWA MITSUYASU (JP)
YAMAMOTO YUKI (JP)
FURUSAWA MITSUYASU (JP)
Application Number:
PCT/JP2018/045146
Publication Date:
June 20, 2019
Filing Date:
December 07, 2018
Export Citation:
Assignee:
KOKI KK (JP)
International Classes:
B23K35/22; B22F1/00; B22F7/08; B23K35/26; B23K35/28; B23K35/30; C22C5/06; C22C9/00; C22C9/02; C22C12/00; C22C13/00; C22C13/02; C22C28/00
Foreign References:
| JP2013258254A | 2013-12-26 | |||
| JP2016219769A | 2016-12-22 | |||
| JP2010285580A | 2010-12-24 | |||
| JP2013163185A | 2013-08-22 | |||
| JP2012250240A | 2012-12-20 |
Attorney, Agent or Firm:
FUJIMOTO & PARTNERS (JP)
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