SOLDER PASTE FOR REDUCTION GAS, AND METHOD FOR PRODUCING SOLDERED PRODUCT

Title:

SOLDER PASTE FOR REDUCTION GAS, AND METHOD FOR PRODUCING SOLDERED PRODUCT

Document Type and Number:

WIPO Patent Application WO/2017/057651

Kind Code:

A1

Abstract:

The present invention is a solder paste that contains no reducing agents or activators, and a method for producing a soldered product for completing solder joints using the solder paste. This solder paste for a reduction gas is used together with a reducing gas, wherein: the solder paste contains a solder powder, a thixotropic agent that is solid at normal temperature, and a solvent; and contains no reducing agents for removing oxidized films or activators for improving reduction properties.

Inventors:

HAYASHI YUKIKO (JP)
SHIRAISHI ARISA (JP)
OZAWA NAOTO (JP)
SUZUKI TAKAYUKI (JP)
SHIRAI TAKESHI (JP)
UCHIDA NORIYOSHI (JP)
FURUSAWA MITSUYASU (JP)

Application Number:

PCT/JP2016/078961

Publication Date:

April 06, 2017

Filing Date:

September 29, 2016

Export Citation:

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Assignee:

ORIGIN ELECTRIC (JP)
KOKI KK (JP)

International Classes:

B23K35/22; B23K1/00; B23K3/04; B23K3/06; B23K31/02; B23K35/363; H05K3/34; B23K35/26; C22C13/00

Foreign References:

JP2006167735A	2006-06-29
JP2000197990A	2000-07-18
JPH08108292A	1996-04-30
JP2010114197A	2010-05-20
JPH02290693A	1990-11-30
JP2004025305A	2004-01-29

Other References: