Title:
SOLDER PASTE
Document Type and Number:
WIPO Patent Application WO/2019/188756
Kind Code:
A1
Abstract:
Provided is a solder paste which uses a conventional flux, and for which long-term preservation is made possible and an easy preservation method can be realized by suppressing changes in the viscosity of the paste over time. This solder paste is provided with a solder powder, a zirconium oxide powder, and a flux, and changes in the viscosity of the paste over time are suppressed.
Inventors:
HAYASHIDA TORU (JP)
YOSHIKAWA SHUNSAKU (JP)
SAITO TAKASHI (JP)
DEI KANTA (JP)
YOSHIKAWA SHUNSAKU (JP)
SAITO TAKASHI (JP)
DEI KANTA (JP)
Application Number:
PCT/JP2019/012009
Publication Date:
October 03, 2019
Filing Date:
March 22, 2019
Export Citation:
Assignee:
SENJU METAL INDUSTRY CO (JP)
International Classes:
B23K35/22; B23K35/26; C22C12/00; C22C13/00; C22C13/02
Foreign References:
| JP2017073448A | 2017-04-13 | |||
| JP2013258254A | 2013-12-26 | |||
| JPH05261586A | 1993-10-12 | |||
| JPH10180483A | 1998-07-07 | |||
| JP2015020182A | 2015-02-02 | |||
| JP2017528327A | 2017-09-28 | |||
| JP2013046929A | 2013-03-07 |
Other References:
See also references of EP 3778107A4
Attorney, Agent or Firm:
KENMOTSU Hidetaka (JP)
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