Title:
SOLDER PASTE
Document Type and Number:
WIPO Patent Application WO/2020/004512
Kind Code:
A1
Abstract:
The present invention relates to a solder paste which contains solder particles and a flux. A part of the surface of the solder particles has a flat portion. By using solder particles having a flat portion on a part of the surface thereof, it is possible to obtain a solder paste having excellent wet spreading properties.
Inventors:
SUKATA SHINICHIROU (JP)
AKAI KUNIHIKO (JP)
EJIRI YOSHINORI (JP)
OKADA YUUHEI (JP)
MORIYA TOSHIMITSU (JP)
MIYAJI MASAYUKI (JP)
AKAI KUNIHIKO (JP)
EJIRI YOSHINORI (JP)
OKADA YUUHEI (JP)
MORIYA TOSHIMITSU (JP)
MIYAJI MASAYUKI (JP)
Application Number:
PCT/JP2019/025498
Publication Date:
January 02, 2020
Filing Date:
June 26, 2019
Export Citation:
Assignee:
HITACHI CHEMICAL CO LTD (JP)
International Classes:
B23K35/14; B22F1/00; B23K35/26; C22C12/00; C22C13/00; C22C28/00; H01B1/00; H01B1/02; H01B1/22; H01B5/00; H01B5/16; H01R11/01; H05K3/32
Foreign References:
JPH01184201A | 1989-07-21 | |||
JP2010036234A | 2010-02-18 | |||
JPH0523887A | 1993-02-02 |
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
Download PDF:
Previous Patent: SOLDER PARTICLES AND METHOD FOR PRODUCING SOLDER PARTICLES
Next Patent: SOLDER PARTICLES
Next Patent: SOLDER PARTICLES