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Patent Searching and Data


Title:
SOLDER PASTE
Document Type and Number:
WIPO Patent Application WO/2020/004512
Kind Code:
A1
Abstract:
The present invention relates to a solder paste which contains solder particles and a flux. A part of the surface of the solder particles has a flat portion. By using solder particles having a flat portion on a part of the surface thereof, it is possible to obtain a solder paste having excellent wet spreading properties.

Inventors:
SUKATA SHINICHIROU (JP)
AKAI KUNIHIKO (JP)
EJIRI YOSHINORI (JP)
OKADA YUUHEI (JP)
MORIYA TOSHIMITSU (JP)
MIYAJI MASAYUKI (JP)
Application Number:
PCT/JP2019/025498
Publication Date:
January 02, 2020
Filing Date:
June 26, 2019
Export Citation:
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Assignee:
HITACHI CHEMICAL CO LTD (JP)
International Classes:
B23K35/14; B22F1/00; B23K35/26; C22C12/00; C22C13/00; C22C28/00; H01B1/00; H01B1/02; H01B1/22; H01B5/00; H01B5/16; H01R11/01; H05K3/32
Foreign References:
JPH01184201A1989-07-21
JP2010036234A2010-02-18
JPH0523887A1993-02-02
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
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