Title:
SOLDER POWDER, METHOD FOR MANUFACTURING SAME, AND METHOD FOR PREPARING SOLDER PASTE USING THIS POWDER
Document Type and Number:
WIPO Patent Application WO/2017/104562
Kind Code:
A1
Abstract:
In the present invention, a nickel metal salt is added to and mixed with a dispersion of copper powder, and the metal salt is dissolved to obtain a first solution in which the copper powder is dispersed. After adjusting the pH of the solution, a first reducing agent is added and mixed so as to reduce the nickel ions, and a dispersion is obtained in which the precipitated nickel coats the copper powder and is dispersed. This solution is subjected to solid-liquid separation and the solids are dried to obtain a metal powder in which copper nuclei are coated with a diffusion preventing layer made of nickel. A tin metal salt is added to and mixed with a dispersion liquid of the metal powder, and the metal salt is dissolved to obtain a second solution in which the metal powder is dispersed. After adjusting the pH of the solution, a second reducing agent is added and mixed so as to reduce the tin ions, and a dispersion is obtained in which the precipitated tin coats the metal powder and is dispersed. This solution is subjected to solid-liquid separation and the solids are dried to obtain a solder powder in which the metal powder is coated with a tin layer.
Inventors:
UESUGI RYUJI (JP)
Application Number:
PCT/JP2016/086694
Publication Date:
June 22, 2017
Filing Date:
December 09, 2016
Export Citation:
Assignee:
MITSUBISHI MATERIALS CORP (JP)
International Classes:
B22F1/00; B22F1/17; B23K35/22; B23K35/26; B23K35/30; B23K35/40
Domestic Patent References:
| WO2013141166A1 | 2013-09-26 |
Foreign References:
| JP2012152782A | 2012-08-16 | |||
| JPS50138771A | 1975-11-05 | |||
| JP2006028630A | 2006-02-02 | |||
| JP2007081141A | 2007-03-29 |
Attorney, Agent or Firm:
SUDA, Masayoshi (JP)
Download PDF: