Title:
SOLDER POWDER, AND SOLDER PASTE USING SOLDER POWDER
Document Type and Number:
WIPO Patent Application WO/2013/031588
Kind Code:
A1
Abstract:
A particle of this solder powder is configured of a core and a coat layer applied on the core, and has an average particle diameter of 5 μm or less. The solder powder is characterized in that: the core is composed of an intermetallic compound of silver and tin or is composed of silver and an intermetallic compound of silver and tin; the coat layer is composed of tin; and an intermediate layer composed of an intermetallic compound of copper and tin is provided between the core and the coat layer such that at least a part of the core is covered.
Inventors:
NAKAGAWA SHO (JP)
MURAOKA HIROKI (JP)
KUBA KANJI (JP)
KAWAMURA YOUSUKE (JP)
MURAOKA HIROKI (JP)
KUBA KANJI (JP)
KAWAMURA YOUSUKE (JP)
Application Number:
PCT/JP2012/071119
Publication Date:
March 07, 2013
Filing Date:
August 22, 2012
Export Citation:
Assignee:
MITSUBISHI MATERIALS CORPOTATION (JP)
NAKAGAWA SHO (JP)
MURAOKA HIROKI (JP)
KUBA KANJI (JP)
KAWAMURA YOUSUKE (JP)
NAKAGAWA SHO (JP)
MURAOKA HIROKI (JP)
KUBA KANJI (JP)
KAWAMURA YOUSUKE (JP)
International Classes:
B23K35/14; B22F1/00; B22F1/17; B23K35/22; B23K35/26
Foreign References:
| JP2008149365A | 2008-07-03 | |||
| JP2004090011A | 2004-03-25 | |||
| JPH05337679A | 1993-12-21 | |||
| JP2012152782A | 2012-08-16 | |||
| JP2012157869A | 2012-08-23 | |||
| JP2012157870A | 2012-08-23 | |||
| JP2004018956A | 2004-01-22 | |||
| JPH06264116A | 1994-09-20 | |||
| JP2008149366A | 2008-07-03 |
Other References:
See also references of EP 2752270A4
Attorney, Agent or Firm:
SUDA, MASAYOSHI (JP)
Masayoshi Suda (JP)
Masayoshi Suda (JP)
Download PDF:
Claims:
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