Title:
SOLDER PROCESSING METHOD AND CONNECTOR SUBJECTED TO SUCH PROCESSING
Document Type and Number:
WIPO Patent Application WO/2006/068228
Kind Code:
A1
Abstract:
Disclosed is a connector wherein no ion migration or the like occurs. Specifically disclosed is a solder processing method for a contact and a conductor arranged in a housing which comprises a step for applying an ultraviolet curable resin over at least a soldered portion after soldering the contact and the conductor, and a step for curing the ultraviolet curable resin by irradiation the ultraviolet curable resin with ultraviolet light. Consequently, there can be prevented short circuits caused by ion migration or the like.
Inventors:
OKANO KAZUYA (JP)
Application Number:
PCT/JP2005/023613
Publication Date:
June 29, 2006
Filing Date:
December 22, 2005
Export Citation:
Assignee:
FCI ASIA TECHNOLOGY PTE LTD (SG)
FRAMATOME CONNECTORS INT (FR)
OKANO KAZUYA (JP)
FRAMATOME CONNECTORS INT (FR)
OKANO KAZUYA (JP)
International Classes:
H05K3/28; H01R43/02; H05K3/34
Foreign References:
| JP2003178826A | 2003-06-27 | |||
| JPH0371585A | 1991-03-27 | |||
| JP2002001521A | 2002-01-08 | |||
| JPH11168275A | 1999-06-22 |
Attorney, Agent or Firm:
Sonoda, Yoshitaka (53rd Floor Shinjuku Mitsui Building, 1-1,
Nishi-Shinjuku 2-chom, Shinjuku-ku Tokyo 53, JP)
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