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Title:
SOLDER RESIST COMPOSITION AND PRINTED CIRCUIT BOARD
Document Type and Number:
WIPO Patent Application WO/2011/125820
Kind Code:
A1
Abstract:
Disclosed is a solder resist composition with high reflectivity and high resolution that includes (A) a carboxyl group-containing resin, (B) a photopolymerization initiator, (C) melamine or a derivative thereof, (D) a photopolymerizable monomer, (E) rutile titanium dioxide, (F) an epoxy compound, and (G) an organic solvent, and that prevents decreases in reflectivity that are attributable to discoloration and deterioration. Also disclosed is a printed circuit board obtained by forming a solder resist using the solder resist composition.

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Inventors:
YODA AIKO (JP)
NOSAKA MAMI (JP)
SHIMAMIYA AYUMU (JP)
USHIKI SHIGERU (JP)
Application Number:
PCT/JP2011/058178
Publication Date:
October 13, 2011
Filing Date:
March 31, 2011
Export Citation:
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Assignee:
TAIYO HOLDINGS CO LTD (JP)
YODA AIKO (JP)
NOSAKA MAMI (JP)
SHIMAMIYA AYUMU (JP)
USHIKI SHIGERU (JP)
International Classes:
G03F7/038; G03F7/004; G03F7/029; G03F7/031; H05K3/28
Foreign References:
JP2008257044A2008-10-23
JP2009102623A2009-05-14
CN101676800A2010-03-24
JP2007249148A2007-09-27
JP2007322546A2007-12-13
JP2010229382A2010-10-14
JP2011070108A2011-04-07
JP2010266556A2010-11-25
JP2010117702A2010-05-27
Attorney, Agent or Firm:
KURATA, Masatoshi et al. (JP)
Masatoshi Kurata (JP)
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