Title:
SOLDER RETURN FOR WAVE SOLDER NOZZLE
Document Type and Number:
WIPO Patent Application WO/2011/116093
Kind Code:
A3
Abstract:
A solder return apparatus (100) for a wave solder machine that (10) collects solder exiting a nozzle and returns the solder to a solder reservoir (24) while limiting the degree to which the solder can splash onto electronic substrates (e.g., printed circuit boards), components of the wave solder machine, and/or the like. The apparatus includes a mounting (114) section that may be placed over an upper surface of the nozzle and a collection section (116) that collects the solder and returns the solder to the solder reservoir (24). The collection section (116) includes a trough (126) having an opening (140) in a bottom wall of the trough and a flow control member (144) that can adjust a quantity of solder exiting the trough as well as the velocity of the solder exiting the trough. One or more deflection plates (156) can be mounted so as to extend from the trough into solder in the solder reservoir to further contain the solder and limit the degree to which splashing solder can reach unintended locations.
Inventors:
YANAROS LARRY (US)
WAGNER FREDERICK (US)
WAGNER FREDERICK (US)
Application Number:
PCT/US2011/028664
Publication Date:
January 19, 2012
Filing Date:
March 16, 2011
Export Citation:
Assignee:
FLEXTRONICS AP LLC (US)
YANAROS LARRY (US)
WAGNER FREDERICK (US)
YANAROS LARRY (US)
WAGNER FREDERICK (US)
International Classes:
B23K1/08; B23K3/06; H05K3/34
Foreign References:
| JP2000114708A | 2000-04-21 | |||
| JPH0593654U | 1993-12-21 | |||
| KR20090005388A | 2009-01-13 |
Attorney, Agent or Firm:
MARSH FISCHMANN & BREYFOGLE LLP (Jonathon A.8055 E.Tufts Avenue, Suite 45, Denver Colorado, US)
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