Title:
SOLDER SAMPLE MANAGEMENT SYSTEM, SOLDER MANAGEMENT SERVER DEVICE, AND SOLDER SAMPLE MANAGEMENT METHOD
Document Type and Number:
WIPO Patent Application WO/2018/198838
Kind Code:
A1
Abstract:
A smartphone 7 is provided with a camera 71 capable of reading tank identification information assigned to a solder tank 3, and reading sample identification information assigned to a container 6, and an identification information acquiring unit 72 which transmits the tank identification information and the sample identification information to a solder management server device 1, wherein the solder management server device 1 includes: a sample information storage unit 17 which associates with one another and stores the tank identification information and the sample identification information transmitted from the smartphone 7; and an analysis result acquiring unit 12 which acquires a component analysis result of a sample accommodated in the container 6 and the sample identification information assigned to the container 6, and causes the same to be associated with one another and stored by the sample information storage unit 17.
Inventors:
NISHIMURA TETSURO (JP)
Application Number:
PCT/JP2018/015603
Publication Date:
November 01, 2018
Filing Date:
April 13, 2018
Export Citation:
Assignee:
NIHON SUPERIOR CO LTD (JP)
International Classes:
B23K1/00; B23K3/06
Foreign References:
| JP2009168569A | 2009-07-30 | |||
| JPH06201831A | 1994-07-22 | |||
| JP2006292688A | 2006-10-26 |
Attorney, Agent or Firm:
YANAGINO Takao et al. (JP)
Download PDF: