Title:
SOLDER TIP, METHOD FOR MANUFACTURING GLASS SUBSTRATE WITH TERMINAL IN WHICH SOLDER TIP IS USED
Document Type and Number:
WIPO Patent Application WO/2016/047733
Kind Code:
A1
Abstract:
[Solution] A solder tip used to join together a terminal and an electroconductive film formed on a glass substrate, wherein the solder tip has a first surface in surface contact with a surface of the electroconductive film facing the terminal and a second surface in surface contact with a surface of the terminal facing the electroconductive film.
Inventors:
YAMAGUCHI MASATOSHI (JP)
YUKI SHINICHIRO (JP)
YUKI SHINICHIRO (JP)
Application Number:
PCT/JP2015/077052
Publication Date:
March 31, 2016
Filing Date:
September 25, 2015
Export Citation:
Assignee:
ASAHI GLASS CO LTD (JP)
International Classes:
B23K1/00; B23K1/19; B23K3/06; H05B3/02; B23K103/12; C03C27/04
Foreign References:
| JPH07329724A | 1995-12-19 | |||
| JPH0697642A | 1994-04-08 | |||
| JP2003161719A | 2003-06-06 | |||
| JP2008027954A | 2008-02-07 | |||
| US20050263571A1 | 2005-12-01 |
Other References:
See also references of EP 3199286A4
Attorney, Agent or Firm:
ITOH, Tadashige et al. (JP)
Tadashige Ito (JP)
Tadashige Ito (JP)
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