Title:
SOLDERED JOINT STRUCTURE
Document Type and Number:
WIPO Patent Application WO/2010/106616
Kind Code:
A1
Abstract:
The strength and durability of a structure composed of two soldered members are improved. Provided is a soldered joint structure (1) which comprises two members (2 and 3) positioned relative to each other and jointed to each other by melting a solder (10) therebetween and penetrating the same thereinto. The two members (2 and 3) include individually two confronting joint faces (6 and 7). One member (3) has solder holding portions (9) for holding the solder (10) in a state to protrude from the joint face (7), and the other member (2) has fitting portions (8) formed for fitting closely the end portion sides of the solder (10) protruding from the joint face (7), thereby to determine the relative positions to the one member (3) through the solder (10).
Inventors:
HIRAO, Toshihiro (1 Toyota-cho, Toyota-sh, Aichi 71, 47185, JP)
Application Number:
JP2009/055033
Publication Date:
September 23, 2010
Filing Date:
March 16, 2009
Export Citation:
Assignee:
TOYOTA JIDOSHA KABUSHIKI KAISHA (1 Toyota-cho, Toyota-shi Aichi, 71, 47185, JP)
トヨタ自動車株式会社 (〒71 愛知県豊田市トヨタ町１番地 Aichi, 47185, JP)
トヨタ自動車株式会社 (〒71 愛知県豊田市トヨタ町１番地 Aichi, 47185, JP)
International Classes:
B23K33/00; F16H57/08
Attorney, Agent or Firm:
WATANABE, Takeo (3rd Floor, Adex Bldg.12-1, Yushima 3-chom, Bunkyo-ku Tokyo 34, 11300, JP)
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