Title:
SOLDERING APPARATUS
Document Type and Number:
WIPO Patent Application WO/2011/105034
Kind Code:
A1
Abstract:
Disclosed is a soldering apparatus wherein, on the outer side of a jetting nozzle (303), which jets a molten solder pressure-fed from a solder bath (102) storing the molten solder, a solder drawing member (402) is removably attached, said solder drawing member being composed of a material having higher molten solder wettability than that of the material of the surface of the jet nozzle (303). With such configuration, a force with which the solder is removed from an area to be soldered is increased corresponding to the surface tension of a molten solder flowing in a solder drawing member (402), and bridge phenomenon and icicle phenomenon can be reduced.
More Like This:
| JP54028755 | SOLDERING METHOD |
| JP07336035 | AUTOMATIC SOLDERING APPARATUS |
| JP60092068 | METHOD AND DEVICE FOR SOLDERING |
Inventors:
YOSHINO, Shinji (())
吉野 信治 (())
YAMAMOTO, Minoru (())
吉野 信治 (())
YAMAMOTO, Minoru (())
Application Number:
JP2011/000896
Publication Date:
September 01, 2011
Filing Date:
February 18, 2011
Export Citation:
Assignee:
PANASONIC CORPORATION (1006, Oaza Kadoma Kadoma-sh, Osaka 01, 〒5718501, JP)
パナソニック株式会社 (〒01 大阪府門真市大字門真１００６番地 Osaka, 〒5718501, JP)
YOSHINO, Shinji (())
吉野 信治 (())
パナソニック株式会社 (〒01 大阪府門真市大字門真１００６番地 Osaka, 〒5718501, JP)
YOSHINO, Shinji (())
吉野 信治 (())
International Classes:
B23K1/08; B23K3/06; H05K3/34; B23K101/42
Attorney, Agent or Firm:
HARADA, Yohei (ORIX Hommachi Bldg, 4th Floor 4-1, Nishi-Honmachi 1-chome, Nishi-ku, Osaka-sh, Osaka 05, 〒5500005, JP)
Download PDF:
Claims:
Previous Patent: CONDUCTIVE BELT AND ELECTROPHOTOGRAPHIC DEVICE
Next Patent: RADIOACTIVE RAY GENERATING APPARATUS AND RADIOACTIVE RAY IMAGING SYSTEM
Next Patent: RADIOACTIVE RAY GENERATING APPARATUS AND RADIOACTIVE RAY IMAGING SYSTEM