Title:
SOLDERING APPARATUS
Document Type and Number:
WIPO Patent Application WO/2018/142733
Kind Code:
A1
Abstract:
Provided is a soldering apparatus whereby work time for soldering can be reduced and non-wetting of solder can be suppressed. A soldering apparatus 100 having a plurality of cylindrical solder-piece guiding pipes 10 having a space through which solder pieces supplied from a supply port are passed, a first retaining part 20 for retaining the solder-piece guiding pipes 10, and a heating part 40 for heating the first retaining part 20, a distal-end part 102 on a soldering side of a solder-piece guiding pipe 40 being disposed on the inside of the first retaining part 20.
Inventors:
HIRAOKA MIKI (JP)
KAWAKITA SHINYA (JP)
KYOI MASAYUKI (JP)
IKEDA OSAMU (JP)
KAWAKITA SHINYA (JP)
KYOI MASAYUKI (JP)
IKEDA OSAMU (JP)
Application Number:
PCT/JP2017/042460
Publication Date:
August 09, 2018
Filing Date:
November 27, 2017
Export Citation:
Assignee:
HITACHI LTD (JP)
International Classes:
B23K3/02; B23K3/06; H05K3/34; B23K101/42
Foreign References:
| JP2013077840A | 2013-04-25 | |||
| JPH0428477A | 1992-01-31 | |||
| JP2017112243A | 2017-06-22 |
Attorney, Agent or Firm:
SEIRYO I.P.C. (JP)
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