Title:
SOLDERING BOARD PRODUCTION METHOD AND SOLDERING DEVICE
Document Type and Number:
WIPO Patent Application WO/2021/125158
Kind Code:
A1
Abstract:
Provided is a method for producing a board in which soldering is performed by means of a solder agent containing a solder and an included substance capable of boiling at a temperature lower than the melting temperature of the solder. In the method, a board is installed on a heating element which is heated to a first predetermined temperature higher than room temperature and lower than the boiling point of the included substance, the temperature of the board installed on the heating element is raised to a second predetermined temperature which is a temperature lower than the melting temperature of the solder and at which reduction is possible, oxides on the board at the second predetermined temperature are reduced by a reducing agent, the board is heated after reduction to a third predetermined temperature equal to or greater than the melting temperature of the solder, and the solder is melted. In addition, a soldering device is provided with: a heating unit for heating a board; a chamber in which the heating unit is accommodated; a reducing agent supply unit that supplies the reducing agent within the chamber; and a control device that controls the temperature of the heating unit and the supply of the reducing agent into the chamber so as to achieve the production method described above.
Inventors:
OZAWA NAOTO (JP)
MATSUDA JUN (JP)
MATSUDA JUN (JP)
Application Number:
PCT/JP2020/046711
Publication Date:
June 24, 2021
Filing Date:
December 15, 2020
Export Citation:
Assignee:
ORIGIN CO LTD (JP)
International Classes:
B23K1/00; B23K1/008; B23K1/20; B23K31/02
Domestic Patent References:
| WO2017057651A1 | 2017-04-06 | |||
| WO2017057651A1 | 2017-04-06 |
Foreign References:
| JP2005222964A | 2005-08-18 | |||
| JP2019228406A | 2019-12-18 |
Other References:
See also references of EP 4079435A4
Attorney, Agent or Firm:
TAIYO, NAKAJIMA & KATO (JP)
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