Title:
SOLDERING CORRECTION DEVICE AND SOLDERING CORRECTION METHOD
Document Type and Number:
WIPO Patent Application WO/2016/075934
Kind Code:
A1
Abstract:
A soldering correction device provided with: an external-appearance inspection device for inspecting soldering defects relating to a workpiece on which a component is mounted, and storing information about the soldering defect locations; and a local trace soldering device for selectively jetting molten solder onto the soldering defect locations while either the workpiece or a jet nozzle for jetting the molten solder moves relative to the other.
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Inventors:
SHIDA ATSUSHI (JP)
YAMAMORI SHINICHI (JP)
SEKINE SHUICHI (JP)
SHIMANUKI KOHEI (JP)
YAMAMORI SHINICHI (JP)
SEKINE SHUICHI (JP)
SHIMANUKI KOHEI (JP)
Application Number:
PCT/JP2015/005621
Publication Date:
May 19, 2016
Filing Date:
November 11, 2015
Export Citation:
Assignee:
TAMURA SEISAKUSHO KK (JP)
International Classes:
H05K3/34; B23K1/08; B23K3/00; B23K3/04
Foreign References:
| JP2585095B2 | 1997-02-26 | |||
| JP2687218B2 | 1997-12-08 | |||
| JP3065750B2 | 2000-07-17 |
Attorney, Agent or Firm:
SUGIURA, Masatomo et al. (JP)
Masatomo Sugiura (JP)
Masatomo Sugiura (JP)
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