SOLDERING DEVICE AND COVER SUPPORT/SEALING STRUCTURE

WIPO Patent Application WO/2011/125669

A1

In the disclosed soldering device, a support and sealing mechanism for covers for a preheating/cooling/etc. treatment vessel is engineered such that the covers can slide freely on top of the treatment vessel and can be supported and sealed with a high degree of airtightness. As shown in figure 2, the disclosed soldering device is provided with a cover support/sealing mechanism (30) that uses a plurality of covers (32) to seal the top of a rectangular heat-treatment unit (20) that has an opening in the upper part thereof. The cover support/sealing mechanism (30) comprises: a plurality of covers (32) that cover the top of the opening in the heat-treatment unit (20), each cover having a pair of multi-grooved rail-like engaging groove parts provided in a prescribed direction; and sliding support members (35a and 35b) that slidably support the covers (32) and have a pair of multi-grooved rail-like engaged groove parts provided along opposing sides of the opening in the heat-treatment unit (20). The engaging groove parts in the covers (32) fit into the engaged groove parts in the sliding support members (35a and 35b).

WO/2003/028413	COUPON REGISTRATION MECHANISM AND METHOD
WO/1996/041507	LOW PROFILE SEMICONDUCTOR DIE CARRIER
JP05013938	PRINTED WIRING BOARD

SUZUKI Takashi (23, SENJU-HASHIDO-CHO, ADACHI-K, Tokyo 55, 〒1208555, JP)

JP2011/057874

October 13, 2011

March 29, 2011

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SENJU METAL INDUSTRY CO., LTD. (23 SENJU-HASHIDO-CHO, ADACHI-KU Tokyo, 55, 〒1208555, JP)
千住金属工業株式会社 (〒55 東京都足立区千住橋戸町２３番地 Tokyo, 〒1208555, JP)

H05K3/34; B23K1/00; B23K1/008; B23K1/08; B23K31/02

YAMAGUCHI INTERNATIONAL PATENT FIRM (Takamura Building 5F, 3-14-7 Yushim, Bunkyo-ku Tokyo 34, 〒1130034, JP)

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