Title:
SOLDERING DEVICE AND METHOD FOR MANAGING SOLDERING DEVICES
Document Type and Number:
WIPO Patent Application WO/2010/116664
Kind Code:
A1
Abstract:
A solder bath, inside which a primary jet nozzle and a secondary jet nozzle are disposed, is filled with molten Sn-Ag-Cu solder; the primary jet nozzle spouts molten solder in a disturbed state and the secondary jet nozzle spouts molten solder in a placid state, causing tiny pieces of tin oxide to float to the surface of the molten solder. By reducing the formation of solder dross, which forms when molten solder gets bound up with tin oxide, this increases the solder utilization rate.
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Inventors:
KAWASHIMA, Yasuji (())
Application Number:
JP2010/002249
Publication Date:
October 14, 2010
Filing Date:
March 29, 2010
Export Citation:
Assignee:
PANASONIC CORPORATION (1006, Oaza Kadoma Kadoma-sh, Osaka 01, 〒5718501, JP)
パナソニック株式会社 (〒01 大阪府門真市大字門真１００６番地 Osaka, 〒5718501, JP)
パナソニック株式会社 (〒01 大阪府門真市大字門真１００６番地 Osaka, 〒5718501, JP)
International Classes:
B23K3/06; B23K1/08; H05K3/34; B23K101/42
Attorney, Agent or Firm:
NAITO, Hiroki et al. (1006 Oaza Kadoma, Kadoma-sh, Osaka 01, 〒5718501, JP)
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