Title:
SOLDERING DEVICE AND METHOD OF MANUFACTURE THEREOF
Document Type and Number:
WIPO Patent Application WO/2010/084946
Kind Code:
A1
Abstract:
Disclosed is a soldering device provided with a soldering tip having a front end and rear end. A blind bore is formed at the rear end of the soldering tip. An accommodating recess is formed at the bottom of this bore. A heater is arranged in the bore. A temperature sensor that is positioned between the heater and the front end of the soldering tip is arranged in this accommodating recess. A pipe is arranged in the accommodating recess. The pipe holds the temperature sensor within the accommodating recess and ensures thermal conduction between the soldering tip and the temperature sensor.
Inventors:
MASAKI, Hiroyuki (4-5 Shiokusa 2-chome, Naniwa-ku, Osaka-sh, Osaka 24, 〒5560024, JP)
Application Number:
JP2010/050779
Publication Date:
July 29, 2010
Filing Date:
January 22, 2010
Export Citation:
Assignee:
HAKKO CORPORATION (4-5 Shiokusa 2-chome, Naniwa-ku Osaka-sh, Osaka 24, 〒5560024, JP)
白光株式会社 (〒24 大阪府大阪市浪速区塩草２丁目４番５号 Osaka, 〒5560024, JP)
白光株式会社 (〒24 大阪府大阪市浪速区塩草２丁目４番５号 Osaka, 〒5560024, JP)
International Classes:
B23K3/03; B23K3/02
Attorney, Agent or Firm:
KOTANI, Etsuji et al. (Osaka Nakanoshima Building 2nd Floor, 2-2 Nakanoshima 2-chome, Kita-ku, Osaka-sh, Osaka 05, 〒5300005, JP)
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