Title:
SOLDERING DEVICE AND METHOD, AND MANUFACTURED SUBSTRATE AND ELECTRONIC COMPONENT
Document Type and Number:
WIPO Patent Application WO/2014/148634
Kind Code:
A1
Abstract:
Space-saving soldering is performed allowing high-reliability soldering at a low cost and a high yield, using a soldering apparatus (100) having: a first process part (110) for setting a component (10) having an electrode (2); a second process part (120) divided by an opening-closing means (119), the second process part (120) sending the component (10) on to a third process part (130); the third process part (130) divided by an opening-closing means (129), the third process part (130) causing the component (10) to contact an organic fatty-acid-containing solution (131) and move horizontally; a fourth process part (140) having a means (33) for moving the component (10) to an empty section (143) and causing molten solder (5) to adhere to the electrode (2), and a means (34) for removing excess molten solder (5); a fifth process part (150) for horizontally moving the component (10) moved downward by the fourth process part; a sixth process part (160) divided by an opening-closing means (159), the sixth process part (160) sending the component (10) on to a seventh process part (170); and the seventh process part (170) divided by an opening-closing means (169), the seventh process part (170) taking out the component (10).
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Inventors:
TANIGURO KATSUMORI (JP)
WATANABE GENZO (JP)
WATANABE GENZO (JP)
Application Number:
PCT/JP2014/057899
Publication Date:
September 25, 2014
Filing Date:
March 20, 2014
Export Citation:
Assignee:
TANIGUROGUMI CORP (JP)
International Classes:
H05K3/34; B23K1/00; B23K1/20; B23K3/04; B23K3/06; B23K101/42
Foreign References:
| JP5079169B1 | 2012-11-21 | |||
| JP5079170B1 | 2012-11-21 | |||
| JP5129898B1 | 2013-01-30 | |||
| JP4665071B1 | 2011-04-06 | |||
| JPH10286936A | 1998-10-27 | |||
| JPH0579170B2 | 1993-11-01 | |||
| JPH0579169B2 | 1993-11-01 |
Other References:
See also references of EP 2978287A4
Attorney, Agent or Firm:
YOSHIMURA, SHUNICHI (JP)
Toshikazu Yoshimura (JP)
Toshikazu Yoshimura (JP)
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