Title:
SOLDERING DEVICE AND METHOD FOR MANUFACTURING SOLDERED PRODUCT
Document Type and Number:
WIPO Patent Application WO/2022/210927
Kind Code:
A1
Abstract:
This soldering device includes: a chamber; a heat source disposed on a bottom surface of the chamber or in the vicinity of the bottom surface; a light-transmissive window provided to a section of a top surface of the chamber; a radiation thermometer which is provided outside the chamber and measures the temperature of an arbitrary position of a workpiece via the window; and a first light-blocking member which closes off a peripheral space between a side surface of the chamber and the workpiece above the heat source in the chamber.
Inventors:
MARUYAMA MEGU (JP)
OZAWA NAOTO (JP)
MATSUDA JUN (JP)
OZAWA NAOTO (JP)
MATSUDA JUN (JP)
Application Number:
PCT/JP2022/016161
Publication Date:
October 06, 2022
Filing Date:
March 30, 2022
Export Citation:
Assignee:
ORIGIN CO LTD (JP)
International Classes:
G01J5/02; B23K1/00; G01J5/00
Domestic Patent References:
| WO2018008215A1 | 2018-01-11 | |||
| WO2013161875A1 | 2013-10-31 |
Foreign References:
| JP2015100841A | 2015-06-04 | |||
| JP2003332727A | 2003-11-21 | |||
| JPH0310128A | 1991-01-17 | |||
| JPH03202733A | 1991-09-04 | |||
| JPH11183257A | 1999-07-09 | |||
| JPS6255529A | 1987-03-11 | |||
| JPS60253928A | 1985-12-14 | |||
| JPH05126632A | 1993-05-21 | |||
| JP2009004436A | 2009-01-08 |
Attorney, Agent or Firm:
TAIYO, NAKAJIMA & KATO (JP)
Download PDF: