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Patent Searching and Data


Title:
SOLDERING DEVICE AND SOLDERING METHOD
Document Type and Number:
WIPO Patent Application WO/2011/049187
Kind Code:
A1
Abstract:
Disclosed are a soldering device and soldering method whereby it is possible to can solder a tab lead to a solar battery cell in a short time without damaging the solar cell. The soldering device (100), which is used to solder a tab lead (15) to a solar cell (10), is equipped with: a preheating section (60) which, with the solar cell (10) and the tab lead (15) overlapping, heats the solar cell (10) and the tab lead (15) to a temperature not greater than the solder melting point; and a soldering section (70) which heats the overlapping section of the solar cell (10) and the tab lead (15) to a temperature above the solder melting point.

Inventors:
ISHIKAWA, Akihiko (())
石川 明彦 (())
KATAYAMA, Manabu (())
片山 学 (())
Application Number:
JP2010/068651
Publication Date:
April 28, 2011
Filing Date:
October 15, 2010
Export Citation:
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Assignee:
Nisshinbo Mechatronics Inc. (2-31-11, Nihonbashi Ningyo-cho Chuo-ku, Tokyo 50, 〒1038650, JP)
日清紡メカトロニクス株式会社 (〒50 東京都中央区日本橋人形町二丁目31番11号 Tokyo, 〒1038650, JP)
Nisshinbo Alps Tech Co., Ltd. (1349, Okubo-cho Nishi-k, Hamamatsu-shi Shizuoka 06, 〒4328006, JP)
日清紡アルプステック株式会社 (〒06 静岡県浜松市西区大久保町1349番地 Shizuoka, 〒4328006, JP)
ISHIKAWA, Akihiko (())
石川 明彦 (())
International Classes:
B23K1/00; B23K3/00; B23K3/04; B23K31/02; H01L31/042; B23K101/36
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