Title:
SOLDERING DEVICE AND SOLDERING METHOD
Document Type and Number:
WIPO Patent Application WO/2014/199694
Kind Code:
A1
Abstract:
The top end (36a) of a return tube (36) is joined to the bottom of a partitioning plate (31) to enclose the entire lower portion of a communicating opening (33). Thus, even when a gas is supplied to a solder reservoir (5), the gas does not enter the inside of the return tube (36) and the inside of the return tube (36) is filled with solder (S). Accordingly, the gas does not enter the lower portion of the communicating opening (33) and gas leakage from the contact section between an on-off valve (24) and the communicating opening (33) is prevented.
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Inventors:
HAYASHI HISAKI (JP)
YOSHIMURA KATSUHIRO (JP)
YOSHIMURA KATSUHIRO (JP)
Application Number:
PCT/JP2014/057910
Publication Date:
December 18, 2014
Filing Date:
March 20, 2014
Export Citation:
Assignee:
FUJITSU TEN LTD (JP)
International Classes:
B23K1/08; B23K3/00; H05K3/34; B23K101/42
Domestic Patent References:
| WO2012143966A1 | 2012-10-26 |
Foreign References:
| JPH08267227A | 1996-10-15 | |||
| JP2006116601A | 2006-05-11 | |||
| JP2012146842A | 2012-08-02 |
Attorney, Agent or Firm:
Shin-Ei Patent Firm, P. C. (JP)
Patent business corporation Shin-Ei Patent Firm (JP)
Patent business corporation Shin-Ei Patent Firm (JP)
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