Title:
SOLDERING DEVICE AND SOLDERING METHOD
Document Type and Number:
WIPO Patent Application WO/2018/025787
Kind Code:
A1
Abstract:
The purpose of the present invention is to prevent poor soldering. A soldered product manufacturing method comprising: a nozzle approach step for causing a first conductor and a nozzle 24, 124, 224, 324, 524, 624 to approach or abut on each other; a solder piece supply step for inserting a supplied solder piece 2a, 202a into the nozzle 24, 124, 224, 324, 524, 624; and a melting step for heating the solder piece 2a, 202a in the nozzle by a heater 36 to melt the solder piece 2a, 202a, wherein the nozzle 24, 124, 224, 324, 524, 624 has a falling restraining part that restrains a lower end or a lower end neighborhood of the solder piece 2a, 202a before melting from falling from the state of being in contact with the solder piece supply-side surface of the first conductor, and in the melting step, the solder piece is melted at a position at which the falling is restrained by the falling restraining part.
Inventors:
NAKA SHINICHIRO (JP)
NAKA IWAO (JP)
NAKA IWAO (JP)
Application Number:
PCT/JP2017/027581
Publication Date:
February 08, 2018
Filing Date:
July 30, 2017
Export Citation:
Assignee:
PARAT CO LTD (JP)
International Classes:
H05K3/34; B23K1/00; B23K3/02; B23K3/06; B23K101/42
Foreign References:
| JP2016059927A | 2016-04-25 | |||
| JP2016100383A | 2016-05-30 | |||
| JP2014146630A | 2014-08-14 | |||
| JP2009195938A | 2009-09-03 | |||
| JP2015076496A | 2015-04-20 | |||
| JP2016182621A | 2016-10-20 | |||
| JP2017074619A | 2017-04-20 |
Other References:
See also references of EP 3493659A4
Attorney, Agent or Firm:
NISHIHARA,Hironori (JP)
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