Title:
SOLDERING DEVICE
Document Type and Number:
WIPO Patent Application WO/2016/104231
Kind Code:
A1
Abstract:
This soldering device (X) is provided with at least a first soldering iron part and a second soldering iron part, which serve as soldering iron parts, each comprising a substantially cylindrical soldering tips (51) having a supply hole used for supplying solder to a board (Bd). The soldering device (X) performs a melting process, in which the supplied solder is melted, and a cleaning process, in which solder residue that has adhered to the soldering tips is removed. The soldering device (X) executes a first operation, in which the cleaning process is performed on the second soldering iron part while the melting process is being performed in the first soldering iron part, and a second operation, in which the cleaning process is performed on the first soldering iron part while the melting process is being performed in the second soldering iron part. Thus, the productivity of the soldering process can be well maintained while cleaning a soldering tip (51).
Inventors:
EBISAWA MITSUO (JP)
Application Number:
PCT/JP2015/084996
Publication Date:
June 30, 2016
Filing Date:
December 15, 2015
Export Citation:
Assignee:
AND CO LTD (JP)
International Classes:
B23K3/02; B23K3/00; H05K3/34; B23K101/42
Domestic Patent References:
| WO2008023461A1 | 2008-02-28 |
Foreign References:
| JPH10216931A | 1998-08-18 | |||
| JPH0613736A | 1994-01-21 | |||
| JP2014146630A | 2014-08-14 | |||
| JPH0679452A | 1994-03-22 |
Attorney, Agent or Firm:
YAMADA, SHIGEKI (JP)
Shigeki Yamada (JP)
Shigeki Yamada (JP)
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