Title:
SOLDERING DEVICE
Document Type and Number:
WIPO Patent Application WO/2018/164038
Kind Code:
A1
Abstract:
Provided is a soldering device comprising: a conveyance means 12 that conveys a substrate 11 on which an electronic part C is mounted; and a heating means that melts solder interposed between an electrode 13 and the electronic part to solder the electronic part to the electrode. The heating means comprises: a coil 20 having a space on the inside thereof; a plurality of ferrites 30 that are arranged in the space of the coil along the conveyance direction of the substrate; an adjustment mechanism 40 that independently adjusts the interval between each ferrite and the electrode formed on the substrate; and a power source 50 that applies an alternating current voltage to the coil to inductively heat the electrode formed on the substrate.
Inventors:
TAJIMA HISAYOSHI (JP)
SUGIYAMA KAZUHIRO (JP)
SUGIYAMA KAZUHIRO (JP)
Application Number:
PCT/JP2018/008269
Publication Date:
September 13, 2018
Filing Date:
March 05, 2018
Export Citation:
Assignee:
TORAY ENG CO LTD (JP)
WONDER FUTURE CORP (JP)
WONDER FUTURE CORP (JP)
International Classes:
B23K1/002; B23K1/00; H05B6/06; H05B6/10; H05K3/34
Domestic Patent References:
| WO2017026286A1 | 2017-02-16 | |||
| WO2017154242A1 | 2017-09-14 |
Foreign References:
| JP2008229709A | 2008-10-02 | |||
| JP2012143805A | 2012-08-02 | |||
| US5390079A | 1995-02-14 |
Attorney, Agent or Firm:
MAEDA & PARTNERS (JP)
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