Title:
SOLDERING DEVICE
Document Type and Number:
WIPO Patent Application WO/2018/164039
Kind Code:
A1
Abstract:
Provided is a soldering device comprising a heating means that solders an electronic part C to an electrode 13, the heating means comprising: a coil 20 having a space on the inside thereof; a plurality of ferrites 30 disposed in the space of the coil; an adjustment mechanism 40 that independently adjusts the interval between each ferrite and the electrode formed on a substrate; and a power source 50 that applies an alternating current voltage to the coil to inductively heat the electrode. The interval between each ferrite and the electrode is adjusted in advance so that the temperature of each electrode that is inductively heated is uniform among a plurality of electrodes disposed inside the coil.
More Like This:
Inventors:
TAJIMA HISAYOSHI (JP)
SUGIYAMA KAZUHIRO (JP)
SUGIYAMA KAZUHIRO (JP)
Application Number:
PCT/JP2018/008271
Publication Date:
September 13, 2018
Filing Date:
March 05, 2018
Export Citation:
Assignee:
TORAY ENG CO LTD (JP)
WONDER FUTURE CORP (JP)
WONDER FUTURE CORP (JP)
International Classes:
B23K1/002; B23K1/00; H05B6/06; H05B6/10; H05K3/34
Domestic Patent References:
| WO2017026286A1 | 2017-02-16 | |||
| WO2017154242A1 | 2017-09-14 |
Foreign References:
| JP2008229709A | 2008-10-02 | |||
| JP2012143805A | 2012-08-02 | |||
| US5390079A | 1995-02-14 |
Attorney, Agent or Firm:
MAEDA & PARTNERS (JP)
Download PDF: