Title:
SOLDERING DEVICE
Document Type and Number:
WIPO Patent Application WO/2021/049553
Kind Code:
A1
Abstract:
Provided is a soldering device including: a soldering iron; a driving unit for moving the soldering iron; an input receiving unit for receiving an input of size information of a work; and a control unit for controlling the driving unit. The control unit includes a coordinate setting unit and a retraction speed setting unit. The coordinate setting unit sets the coordinate of a specific location that is a predetermined distance away from a soldering position on the basis of the size information. The retraction speed setting unit sets the speed of the iron tip at a spaced position to a predetermined speed and sets the retraction speed from the soldering position to the specific location to a speed lower than the predetermined speed.
Inventors:
MISHIMA YUTA (JP)
YAMAMOTO TERUHIKO (JP)
TERAOKA YOSHITOMO (JP)
YAMAMOTO TERUHIKO (JP)
TERAOKA YOSHITOMO (JP)
Application Number:
PCT/JP2020/034200
Publication Date:
March 18, 2021
Filing Date:
September 09, 2020
Export Citation:
Assignee:
HAKKO CORP (JP)
International Classes:
B23K3/00
Foreign References:
| JP2019115918A | 2019-07-18 | |||
| JPH06302947A | 1994-10-28 | |||
| JP2018114553A | 2018-07-26 |
Attorney, Agent or Firm:
KOTANI, Masataka et al. (JP)
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