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Title:
SOLDERING MATERIAL FOR SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2017/047289
Kind Code:
A1
Abstract:
Provided is a lead-free solder that has high heat-resistance temperature and a heat conduction property which remains unaffected in a high-temperature range. The present invention pertains to: a soldering material comprising more than 5.0 mass% but not more than 10.0 mass% of Sb, and 2.0-4.0 mass% of Ag, the remaining portion being Sn and unavoidable impurities; and a semiconductor device provided with a bonding layer containing the soldering material between a semiconductor element and a substrate electrode or a lead frame.

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Inventors:
WATANABE HIROHIKO (JP)
SAITO SHUNSUKE (JP)
NISHIMURA YOSHITAKA (JP)
MOMOSE FUMIHIKO (JP)
Application Number:
PCT/JP2016/073406
Publication Date:
March 23, 2017
Filing Date:
August 09, 2016
Export Citation:
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Assignee:
FUJI ELECTRIC CO LTD (JP)
International Classes:
B23K35/26; C22C13/02; H01L21/52
Domestic Patent References:
WO2014181883A12014-11-13
WO2011151894A12011-12-08
Foreign References:
JPH07284983A1995-10-31
JPH081372A1996-01-09
JP2001252787A2001-09-18
JPS4016897B
US4170472A1979-10-09
JP2008031550A2008-02-14
JP2007152385A2007-06-21
JP2006035310A2006-02-09
JP2012119609A2012-06-21
JP2011121062A2011-06-23
Attorney, Agent or Firm:
OKUYAMA, Shoichi et al. (JP)
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