Title:
SOLDERING METHOD AND APPARATUS FOR MOUNTING COMPONENT ON PRINTED WIRING BOARD
Document Type and Number:
WIPO Patent Application WO/2008/015731
Kind Code:
A1
Abstract:
When a component is soldered to a printed wiring board (45) for mounting, the printed
wiring board to which the component is soldered is heated in a high-oxygen-concentration
oxygen atmosphere for forming oxide films (31-39) on the surface of joined portions
(109, 111-114). Consequently, the component soldered to the surface of the printed
wiring board is prevented from dropping, displacement or lifting from the printed
wiring board during reflow of the printed wiring board.
Inventors:
ISHIKAWA, Tetsuji (1-1 Kamikodanaka 4-chome, Nakahara-ku, Kawasaki-sh, Kanagawa 88, 2118588, JP)
石川 鉄二 (〒88 神奈川県川崎市中原区上小田中４丁目１番１号 富士通株式会社内 Kanagawa, 2118588, JP)
石川 鉄二 (〒88 神奈川県川崎市中原区上小田中４丁目１番１号 富士通株式会社内 Kanagawa, 2118588, JP)
Application Number:
JP2006/315161
Publication Date:
February 07, 2008
Filing Date:
July 31, 2006
Export Citation:
Assignee:
FUJITSU LIMITED (1-1 Kamikodanaka 4-chome, Nakahara-ku Kawasaki-sh, Kanagawa 88, 2118588, JP)
富士通株式会社 (〒88 神奈川県川崎市中原区上小田中４丁目１番１号 Kanagawa, 2118588, JP)
ISHIKAWA, Tetsuji (1-1 Kamikodanaka 4-chome, Nakahara-ku, Kawasaki-sh, Kanagawa 88, 2118588, JP)
富士通株式会社 (〒88 神奈川県川崎市中原区上小田中４丁目１番１号 Kanagawa, 2118588, JP)
ISHIKAWA, Tetsuji (1-1 Kamikodanaka 4-chome, Nakahara-ku, Kawasaki-sh, Kanagawa 88, 2118588, JP)
International Classes:
H05K3/34; B23K1/00
Attorney, Agent or Firm:
AOKI, Atsushi et al. (SEIWA PATENT & LAW, Toranomon 37 Mori Bldg.5-1, Toranomon 3-chom, Minato-ku Tokyo, 105-8423, JP)