Title:
SOLDERING METHOD AND DEVICE FOR FLEXIBLE CIRCUIT BOARD AND PRINTED CIRCUIT BOARD
Document Type and Number:
WIPO Patent Application WO/2020/216169
Kind Code:
A1
Abstract:
A soldering method and device for a flexible circuit board and a printed circuit board. The soldering method comprises: bonding a reinforcement plate (103) on the flexible circuit board (101) by means of a glue (102) to obtain a surface mount device (100); using a surface mount technique to solder the surface mount device (100) on a first circuit board so as to solder the flexible circuit board (101) with the first circuit board; and peeling off the reinforcement plate (103) and the glue (102) from the surface mount device (100) so as to obtain an interconnection device between the flexible circuit board (101) and the first circuit board. The method can reduce the space occupied by an FOB interconnection product.
More Like This:
Inventors:
YANG JUNJIE (CN)
YANG YINGXI (CN)
WANG ZHIQIANG (CN)
HE LIRONG (CN)
JIANG FAN (CN)
LI WENJING (CN)
DENG LINGCHAO (CN)
LIU PENG (CN)
YANG YINGXI (CN)
WANG ZHIQIANG (CN)
HE LIRONG (CN)
JIANG FAN (CN)
LI WENJING (CN)
DENG LINGCHAO (CN)
LIU PENG (CN)
Application Number:
PCT/CN2020/085560
Publication Date:
October 29, 2020
Filing Date:
April 20, 2020
Export Citation:
Assignee:
HUAWEI TECH CO LTD (CN)
International Classes:
H05K3/36; H05K1/14
Foreign References:
| CN208353738U | 2019-01-08 | |||
| CN101702870A | 2010-05-05 | |||
| CN109041444A | 2018-12-18 | |||
| CN101384136A | 2009-03-11 | |||
| CN105578763A | 2016-05-11 | |||
| US20160066436A1 | 2016-03-03 |
Download PDF: