Title:
SOLDERING NOZZLE, SOLDERING DEVICE, SOLDERING METHOD, AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD
Document Type and Number:
WIPO Patent Application WO/2019/211998
Kind Code:
A1
Abstract:
A soldering nozzle (20) is provided with an outer frame (21), a first partition wall (22a), and a second partition wall (22b). The outer frame (21) includes a flow path (21a) having an opening (OP) through which molten solder (2) is jetted out for soldering. The first partition wall (22a) partitions, in the longitudinal direction (D1) of the opening (OP), the flow path (21a) of the outer frame (21) into a first end portion (21a1) and a center portion (21a3). The second partition wall (22b) partitions, in the longitudinal direction (D1), the flow path (21a) into a second end portion (21a2) and the center portion (21a3). The soldering nozzle (20) is configured to allow the molten solder (2) to flow from the first end portion (21a1) to the center portion (21a3) over the first partition wall (22a), and to flow from the second end portion (21a2) to the center portion (21a3) over the second partition wall (22b).
Inventors:
AJIOKA SHOICHI (JP)
SASAKI SHUNSUKE (JP)
TANABE TSUYOSHI (JP)
KITAGAWA NOBUYASU (JP)
SASAKI SHUNSUKE (JP)
TANABE TSUYOSHI (JP)
KITAGAWA NOBUYASU (JP)
Application Number:
PCT/JP2019/016994
Publication Date:
November 07, 2019
Filing Date:
April 22, 2019
Export Citation:
Assignee:
MITSUBISHI ELECTRIC CORP (JP)
International Classes:
B23K1/08; B23K1/00; H05K3/34
Domestic Patent References:
| WO2012143967A1 | 2012-10-26 |
Foreign References:
| JP2011035044A | 2011-02-17 | |||
| JP2010269341A | 2010-12-02 | |||
| JPS63220972A | 1988-09-14 | |||
| JPH06561U | 1994-01-11 |
Attorney, Agent or Firm:
FUKAMI PATENT OFFICE, P.C. (JP)
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