Title:
SOLDERING PASTE, BONDING METHOD USING SAME, AND BONDING STRUCTURE
Document Type and Number:
WIPO Patent Application WO/2011/027659
Kind Code:
A1
Abstract:
Disclosed is a soldering paste that has excellent strength at high temperatures, has favorable diffusion of a first metal and a second metal during a soldering step, generates an intermetallic compound having a high melting point at a low temperature and in a short period of time, and wherein after soldering, almost none of the first metal remains. Further disclosed is a bonding structure and a bonding method that produces highly reliable bonds utilizing the soldering paste. The soldering paste contains a flux component and a metal component comprising a powder of the first metal and a powder of the second metal, which has a higher melting point than said first metal; and the first metal is Sn or an alloy containing Sn, and the second metal is a metal or alloy that, with the first metal, generates an intermetallic compound having a melting point that is at least 310°C and that has a lattice constant difference, which is the difference between the lattice constant of the aforementioned intermetallic compound and the lattice constant of the aforementioned second metal component, of at least 50%. Also, the proportion of the second metal in the metal component is at least 30 % by volume. A Cu-Mn alloy or a Cu-Ni alloy is used as the second metal.
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Inventors:
NAKANO, Kosuke (10-1, Higashikotari 1-chome, Nagaokakyo-sh, Kyoto 55, 〒6178555, JP)
中野公介 (〒55 京都府長岡京市東神足１丁目１０番１号 株式会社村田製作所内 Kyoto, 〒6178555, JP)
中野公介 (〒55 京都府長岡京市東神足１丁目１０番１号 株式会社村田製作所内 Kyoto, 〒6178555, JP)
Application Number:
JP2010/063681
Publication Date:
March 10, 2011
Filing Date:
August 12, 2010
Export Citation:
Assignee:
MURATA MANUFACTURING CO.,LTD. (10-1, Higashikotari 1-chome Nagaokakyo-sh, Kyoto 55, 〒6178555, JP)
株式会社村田製作所 (〒55 京都府長岡京市東神足１丁目１０番１号 Kyoto, 〒6178555, JP)
NAKANO, Kosuke (10-1, Higashikotari 1-chome, Nagaokakyo-sh, Kyoto 55, 〒6178555, JP)
株式会社村田製作所 (〒55 京都府長岡京市東神足１丁目１０番１号 Kyoto, 〒6178555, JP)
NAKANO, Kosuke (10-1, Higashikotari 1-chome, Nagaokakyo-sh, Kyoto 55, 〒6178555, JP)
International Classes:
B23K35/22; B23K1/00; B23K35/26; B23K35/30; B23K35/363; C22C9/05; C22C9/06; C22C13/00; H05K3/34; B23K101/42; C22C9/04; C22C12/00
Attorney, Agent or Firm:
NISHIZAWA, Hitoshi (5th Floor, Daido Seimei Minami-kan 1-2-11, Edobori, Nishi-ku, Osaka-sh, Osaka 02, 〒5500002, JP)
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