Title:
SOLID FLOOR ASSEMBLY WITH A DESIGNABLE WIRE DUCT SPACE
Document Type and Number:
WIPO Patent Application WO/2008/098413
Kind Code:
A1
Abstract:
A solid floor assembly with a designable wire duct space includes a base body (1) formed
with four integrated columnar blocks (11) on an upper surface along the periphery
thereof, a duct layer member (2) with cuttable slots therein and a cover board
(3) overlying the upper surfaces of the base body (1) and the duct layer member (2).
A duct for pipes or wires is formed between the duct layer member (2) and the columnar
blocks (11) by arranging the duct layer member (2) in the inner space defined by
the four columnar blocks (11). The floor assembly may be formed with outlets for
wires, antislip grains or patterns on the surface.
Inventors:
CHEN, Chih Jung (22F No .106, Sec. 1 Sintai 5th Rd., SiJhi, Taipei County 221 Taiwan, Taiwan, CN)
Application Number:
CN2007/000483
Publication Date:
August 21, 2008
Filing Date:
February 12, 2007
Export Citation:
Assignee:
CHEN, Chih Jung (22F No .106, Sec. 1 Sintai 5th Rd., SiJhi, Taipei County 221 Taiwan, Taiwan, CN)
International Classes:
E04F15/024; E04C2/52; E04F15/18; E04F15/024; E04C2/52; E04F15/18
Attorney, Agent or Firm:
KELONG INTERNATIONAL INTELLECTUAL PROPERTY AGENT LTD. (Suite 13-3, Bldg. AHorizon International Tower,No. 6 Zhichun Road,Haidian District, Beijing 8, 100088, CN)