SOLID IMAGING DEVICE - HAMAMATSU PHOTONICS KK

Title:

SOLID IMAGING DEVICE

Document Type and Number:

WIPO Patent Application WO/2010/113760

Kind Code:

A1

Abstract:

In a solid imaging device (1), an overflow gate (5) has a predetermined electrical resistance, and voltage-applying units (161 - 165) are electrically connected to the overflow gate (5) at connection points (171 - 175). As a result, by adjusting the voltages (V1 - V5) applied to the connection points (171 - 175) by the voltage-applying units (161 - 165), it is possible to raise the voltage arising at the front stage of the overflow gate (5) and lower the voltage arising at the back stage of the overflow gate (5). As a result, the barrier level (potential) at the front stage of the overflow gate (5) is lowered, and the barrier level at the back stage of the overflow gate (5) is raised, and so all of the load arising at the front stage of a photoelectric conversion unit (2) flows to an overflow drain (4), and only the load arising at the back stage of the photoelectric conversion unit (2) is time delay and integration (TDI) transmitted.

More Like This:

JP2005117192	DRIVE METHOD OF SOLID-STATE IMAGING APPARATUS, AND CAMERA EMPLOYING THE SAME
JPH04369268	CCD SOLID-STATE IMAGE SENSOR
JPS62269355	SOLID-STATE IMAGE SENSING ELEMENT

Inventors:

SUZUKI HISANORI (JP)
YONETA YASUHITO (JP)
MAETA KENTARO (JP)
MURAMATSU MASAHARU (JP)

Application Number:

PCT/JP2010/055239

Publication Date:

October 07, 2010

Filing Date:

March 25, 2010

Export Citation:

Click for automatic bibliography generation Help

Assignee:

HAMAMATSU PHOTONICS KK (JP)
SUZUKI HISANORI (JP)
YONETA YASUHITO (JP)
MAETA KENTARO (JP)
MURAMATSU MASAHARU (JP)

International Classes:

H01L27/148; H01L27/146; H04N5/335; H04N5/369; H04N5/372

Foreign References:

JP2002231914A	2002-08-16
JP2003521837A	2003-07-15
JP2002064197A	2002-02-28
JP2003521837A	2003-07-15
JPH11298805A	1999-10-29

Other References: