Title:
SOLID METAL BLOCK MOUNTING SUBSTRATES FOR SEMICONDUCTOR LIGHT EMITTING DEVICES, AND OXIDIZING METHODS FOR FABRICATING SAME
Document Type and Number:
WIPO Patent Application WO2005027233
Kind Code:
A3
Abstract:
A mounting substrate for a semiconductor light emitting device includes a solid metal block having a cavity in a face thereof that is configured for mounting a semiconductor light emitting device therein. An insulating coating is provided in the cavity, and first and second spaced apart conductive traces are provided on the insulating coating in the cavity that are configured for connection to a semiconductor light emitting device. The mounting substrate may be fabricated by providing a solid aluminum block including a cavity in a face thereof that is configured for mounting a semiconductor light emitting device therein. The solid aluminum block is oxidized to form an aluminum oxide coating thereon. The first and second spaced apart electrical traces are fabricated on the aluminum oxide coating in the cavity.
Inventors:
NEGLEY GERALD H (US)
LOH BAN (US)
LOH BAN (US)
Application Number:
PCT/US2004/017326
Publication Date:
September 09, 2005
Filing Date:
June 01, 2004
Export Citation:
Assignee:
CREE INC (US)
NEGLEY GERALD H (US)
LOH BAN (US)
NEGLEY GERALD H (US)
LOH BAN (US)
International Classes:
H01L33/48; (IPC1-7): H01L33/00; H01S5/022
Foreign References:
| EP0439227A1 | 1991-07-31 | |||
| US6480389B1 | 2002-11-12 | |||
| US20030098459A1 | 2003-05-29 | |||
| US6531328B1 | 2003-03-11 |
Other References:
PATENT ABSTRACTS OF JAPAN vol. 1998, no. 09 31 July 1998 (1998-07-31)
PATENT ABSTRACTS OF JAPAN vol. 1996, no. 09 30 September 1996 (1996-09-30)
PATENT ABSTRACTS OF JAPAN vol. 1997, no. 07 31 July 1997 (1997-07-31)
PATENT ABSTRACTS OF JAPAN vol. 1996, no. 09 30 September 1996 (1996-09-30)
PATENT ABSTRACTS OF JAPAN vol. 1997, no. 07 31 July 1997 (1997-07-31)
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