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Title:
SOLID MICROPARTICLE MASS MEASUREMENT DEVICE
Document Type and Number:
WIPO Patent Application WO/2019/097769
Kind Code:
A1
Abstract:
This solid microparticle mass measurement device includes: a solid microparticle adherence region (109) which is disposed at a surface elastic wave propagation region (105) and to which solid microparticles are caused to adhere; and a solid microparticle adherence amount detection unit (signal detection circuit) (91) which detects the adherence amount of solid microparticles adhered to the solid microparticle adherence region.

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Inventors:
ODAKA TAKAHIRO (JP)
ISOBE ATSUSHI (JP)
Application Number:
PCT/JP2018/028452
Publication Date:
May 23, 2019
Filing Date:
July 30, 2018
Export Citation:
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Assignee:
HITACHI METALS LTD (JP)
International Classes:
G01N29/02; G01N29/024; H03H9/145
Domestic Patent References:
WO2013108608A12013-07-25
Foreign References:
GB2371362A2002-07-24
JP2009109261A2009-05-21
JP2008275503A2008-11-13
JP2015210080A2015-11-24
JP2003502616A2003-01-21
JP2015081861A2015-04-27
JP2004069686A2004-03-04
Attorney, Agent or Firm:
SEIRYO I.P.C. (JP)
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