Title:
SOLID-STAGE IMAGING DEVICE AND MANUFACTURING METHOD THEREFOR
Document Type and Number:
WIPO Patent Application WO/2012/035702
Kind Code:
A1
Abstract:
A solid-state imaging device that has a pixel region comprising a plurality of pixels arranged two-dimensionally. In said solid-state imaging device, a semiconductor substrate and an interlayer insulation film are layered in sequence, and a photoelectric conversion film sandwiched between a bottom electrode and a light-transmitting top electrode is formed on top of the interlayer insulation film. The top electrode covers the entire top of the photoelectric conversion film, and metal wiring is laminated onto at least part of the top electrode so as to pass between adjacent pixels. Said metal wiring comprises a material that has a lower electrical resistivity than the top electrode.
Inventors:
YASUHIRA MITSUO
YOKOYAMA HARUHISA
YOKOYAMA HARUHISA
Application Number:
PCT/JP2011/004614
Publication Date:
March 22, 2012
Filing Date:
August 18, 2011
Export Citation:
Assignee:
PANASONIC CORP (JP)
YASUHIRA MITSUO
YOKOYAMA HARUHISA
YASUHIRA MITSUO
YOKOYAMA HARUHISA
International Classes:
H01L27/146; H01L27/14; H01L31/0248; H04N5/369
Foreign References:
| JPS57211770A | 1982-12-25 | |||
| JPH1187683A | 1999-03-30 | |||
| JPH1197664A | 1999-04-09 | |||
| JPS61177773A | 1986-08-09 |
Attorney, Agent or Firm:
NAKAJIMA, Shiro et al. (JP)
Shiro Nakajima (JP)
Shiro Nakajima (JP)
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