Title:
SOLID-STATE IMAGE CAPTURE DEVICE AND IMAGE CAPTURE DEVICE
Document Type and Number:
WIPO Patent Application WO/2014/125871
Kind Code:
A1
Abstract:
In a solid-state image capture device, wherein a first substrate and a second substrate are layered and electrically connected by a connecting part: the first substrate comprises a pixel unit which is positioned in a matrix shape and which outputs a signal according to an entering light quantity, and a first wiring unit which connects the pixel unit and the connecting part; the second substrate comprises a column processing circuit which processes the signal which is emitted by the pixel unit, and a second wiring unit which connects the connecting part and the column processing circuit; and the sum of the wire resistance of the first wiring unit and the wire resistance of the second wiring unit is approximately equivalent in each column.
Inventors:
KOBAYASHI KENJI (JP)
Application Number:
PCT/JP2014/050809
Publication Date:
August 21, 2014
Filing Date:
January 17, 2014
Export Citation:
Assignee:
OLYMPUS CORP (JP)
International Classes:
H04N5/357; H01L27/14; H01L27/146; H04N5/369; H04N5/374; H04N5/378
Foreign References:
| JP2003057350A | 2003-02-26 | |||
| JP2008271159A | 2008-11-06 |
Attorney, Agent or Firm:
TANAI Sumio et al. (JP)
Sumio Tanai (JP)
Sumio Tanai (JP)
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