Title:
SOLID-STATE IMAGE CAPTURE DEVICE AND ELECTRONIC APPARATUS
Document Type and Number:
WIPO Patent Application WO/2018/180569
Kind Code:
A1
Abstract:
The present technology relates to a solid-state image capture device which enables suppression of the appearance of ghost noise in the output of a sensor substrate having a light-shield substrate stacked on an upper surface thereof, and to an electronic apparatus. A solid-state image capture device according to a first aspect of the present technology is provided with a sensor substrate having at least a first pixel region and a second pixel region, and a light-shield substrate which is stacked on an upper surface of the sensor substrate and which includes a light-shield surrounding a plurality of light guide paths. The plurality of light guide paths include at least a first light guide path corresponding to the first pixel region and a second light guide path corresponding to the second pixel region. A plurality of pixels included in the first pixel region have a light-shielding structure based on the respective pixel positions in the first pixel region. A plurality of pixels included in the second pixel region have a light-shielding structure based on the respective pixel positions in the second pixel region. The present technology may be applied in a back-illuminated CMOS image sensor, for example.
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Inventors:
TANAKA HARUMI (JP)
Application Number:
PCT/JP2018/010377
Publication Date:
October 04, 2018
Filing Date:
March 16, 2018
Export Citation:
Assignee:
SONY SEMICONDUCTOR SOLUTIONS CORP (JP)
International Classes:
H01L27/146; H04N5/357; H04N5/369
Domestic Patent References:
| WO2016208403A1 | 2016-12-29 |
Foreign References:
| JP2010091864A | 2010-04-22 | |||
| JP2001223846A | 2001-08-17 | |||
| JP2005072662A | 2005-03-17 |
Attorney, Agent or Firm:
NISHIKAWA Takashi et al. (JP)
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