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Title:
SOLID-STATE IMAGE CAPTURE DEVICE AND IMAGE CAPTURE DEVICE
Document Type and Number:
WIPO Patent Application WO/2019/224936
Kind Code:
A1
Abstract:
A solid-state image capture device formed from a semiconductor substrate having a first surface for forming an element and a second surface which opposes the first surface and on which light is incident is provided with: a plurality of pixels which are formed in a 2-dimensional matrix on the first surface, and include a photoelectric conversion element for generating a signal charge corresponding to the amount of incident light; a first substrate electrode for applying a first reference potential to the first surface side of the pixels; and a second substrate electrode for applying a second reference potential to the second surface side of the pixels.

Inventors:
KOYAMA YUSAKU (JP)
Application Number:
PCT/JP2018/019823
Publication Date:
November 28, 2019
Filing Date:
May 23, 2018
Export Citation:
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Assignee:
OLYMPUS CORP (JP)
International Classes:
H01L27/146; H04N5/369; H04N9/07
Domestic Patent References:
WO2018043654A12018-03-08
Foreign References:
JP2004103964A2004-04-02
JP2011211497A2011-10-20
Attorney, Agent or Firm:
TANAI Sumio et al. (JP)
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